Loyola University Chicago School of Law is hosting the 2020 Patent Law Interview
Program on Thursday and Friday, July 23-24 in Chicago, Illinois. This nationwide
interview program targets patent law employers and rising 2L and 3L students.
If you are returning to law school in Fall 2020, you are eligible to apply.
Last year roughly 150 employers, 190 law schools, and 1,100 law students from across
the country participated in the program. The program is entirely pre-selected, which
means that students submit application materials to apply to interviews with the
employers they are interested in, and employers then review their materials and select the
students they wish to interview at the program. Last year, approximately half of the
participating students were selected for interviews.
Students with undergraduate or graduate degrees in engineering or a technical science
should consider registering for the program. You do not need to be patent bar eligible to
register, although the vast majority of employers participating in the program are seeking
patent bar eligible students.
For more information on the program, please refer to the Loyola Patent Program website
at: https://www.luc.edu/law/currentstudents/careerservices/patentprogram/.
Registration Information
Online student registration for this year’s Patent Law Interview Program is now open and closes on Friday, March 6.
Students can register at:
https://epay.luc.edu/C20996_ustores/web/classic/store_main.jsp?STOREID=311&SINGLESTORE=true
At this stage of registration, you will only need to enter some basic information (you will
upload your resume and bid on interviews later in the semester).
There is a non-refundable $40 dollar registration fee that you must pay by credit card to
complete your online registration. Please have your credit card ready when you register.
Once you have registered, the program staff will communicate with you directly via
email to the address that you entered when registering for the program. Please direct any
questions about the program to Professor Fuith (leanne.fuith@mitchellhamline.edu), Mitchell Hamline’s Patent Program Liaison.